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Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch interconnects (also known as die-to-die bonding and chain bonding), reverse bonding, and ribbon bonding.
The global Wire Wedge Bonder Equipment market will reach xxx Million USD in 2017. 99Strategy said IDMs dominates the largest Application share in 201 -
Table Of Content
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Table of Content
1 Industry Overview
1.1 Wire Wedge Bonder Equipment Industry
1.1.1 Overview
1.1.2 Development of Wire Wedge Bonder Equipment
1.2 Market Segment
1.2.1 Upstream
1.2.2 Downstream
1.3 Cost Analysis
2 Industry Environment
2.1 Policy
2.2 Economics
2.3 Sociology
2.4 Technology
3 Wire Wedge Bonder Equipment Market by Type
3.1 -
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