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Lead Frame, as the foundation of semiconductor packaging material, is a metal frame which provides support for an integrated circuit chip or die, and with the aids of bonding material (wire, aluminum wire, copper wire), lead frame is electrical lead to interconnect the integrated circuit on the die or chip to other electrical components or contacts. The main function of lead frame is for
Table of Content
1 Industry Overview
1.1 Lead Frame Industry
1.1.1 Overview
1.1.2 Development of Lead Frame
1.2 Market Segment
1.2.1 By Product Type
1.2.2 By Application
1.3 Asia-Pacific Overview
2 Major Companies List
2.1 SH Materials (Company Profile, Products & Services, Sales Data etc.)
2.2 Mitsui High-tec (Company Profile, Products & Service