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During the final stages of semiconductor development, a tiny block of materials (the silicon wafer, logic, and memory) is wrapped in a supporting case that prevents physical damage and corrosion and allows the chip to be connected to a circuit board. Typical packaging configurations have included the leadless chip carriers and pin-grid arrays of the 1980s, the system-in-package and packag
Table of Content
1 Industry Overview
1.1 Advanced Packaging Industry
1.1.1 Overview
1.1.2 Products of Major Companies
1.2 Market Segment
1.2.1 Industry Chain
1.2.2 Consumer Distribution
1.3 Price & Cost Overview
2 Advanced Packaging Market by Type
2.1 By Type
2.1.1 3.0 DIC
2.1.2 FO SIP
2.1.3 FO WLP
2.1.4 3D WLP
2.1.