Global Low Pressure Molding with Polyamides Market Study 2015-2025, by Segment (Black Type, Amber Type, Others), by Market (Electronics, AutomotiveAmber Type, Textile industry), by Company (Henkel, Bostik, MoldMan)
ReportPage
Report ID
16233
Published Date
25-Sep
No of Report Page
62
Report Category
Chemicals and Materials
Editor's Rating
US $3,600.00
US $3,600.00
US $1,800.00

  • Report Details 
    Snapshot
    
Low pressure molding with polyamides is a process typically used to encapsulate and environmentally protect electronic components (such as circuit boards). The purpose is to protect electronics against moisture, dust dirt and vibration. It is also used for sealing connectors and molding grommets and strain reliefs.
    
The global Low Pressure Molding with Polyamides market will reach xxx Mill
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  • Table Of Content 
    Table of Content
    
1 Industry Overview
    
    1.1 Low Pressure Molding with Polyamides Industry
    
        1.1.1 Overview
    
        1.1.2 Products of Major Companies
    
    1.2 Market Segment
    
        1.2.1 Industry Chain
    
        1.2.2 Consumer Distribution
    
    1.3 Price & Cost Overview
    
2 Low Pressure Molding with Polyamides Market by Type
    
    2.1 By Type
    
       2.1.1 Black Type
    
       2.1.2 Amber Type
    
       2
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