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In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as “ball” or “bumps”) is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
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Table of Content
1 Industry Overview
1.1 Solder Ball Industry
Figure Solder Ball Industry Chain Structure
1.1.1 Overview
1.1.2 Development of Solder Ball
1.2 Market Segment
1.2.1 Upstream
Table Upstream Segment of Solder Ball
1.2.2 Downstream
Table Application Segment of Solder Ball
Table Globa