Global Underfill Market Analysis 2015-2019 and Forecast 2020-2025

ReportPage
Report ID
62471
Published Date
11-Jan
No of Report Page
100
Report Category
Chemicals and Materials
Editor's Rating
US $5,960.00
US $5,960.00
US $2,980.00

  • Report Details

    Snapshot
    Underfill is used to fill space beneath a die and adhere to its carrier. They add structural strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfill can be found in a wide variety of applications including mobile phone, game console, computor, tablet PC and digital camera.
    The global Underfill market size is estimated at xxx mill

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  • Table Of Content

    Table of Content

    1 Industry Overview
    1.1 Underfill Industry
    Figure Underfill Industry Chain Structure
    1.1.1 Overview
    1.1.2 Development of Underfill
    1.2 Market Segment
    1.2.1 Upstream
    Table Upstream Segment of Underfill
    1.2.2 Downstream
    Table Application Segment of Underfill
    Table Global Underfil

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