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Underfill is used to fill space beneath a die and adhere to its carrier. They add structural strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfill can be found in a wide variety of applications including mobile phone, game console, computor, tablet PC and digital camera.
The global Underfill market size is estimated at xxx mill
Table of Content
1 Industry Overview
1.1 Underfill Industry
Figure Underfill Industry Chain Structure
1.1.1 Overview
1.1.2 Development of Underfill
1.2 Market Segment
1.2.1 Upstream
Table Upstream Segment of Underfill
1.2.2 Downstream
Table Application Segment of Underfill
Table Global Underfil