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Wire bonder equipment is the machinery used for making interconnects between an IC or any other semiconductor device at the time of packaging. This interconnection ensures the flow of electricity in the semiconductor device. The thin-wire used to make these connections are usually made of copper, gold, aluminum, or silver. Wire bonder equipment is part of the semiconductor assembly and pa -
Table Of Content
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Table of Content
1 Industry Overview
1.1 Wire Bonder Equipment Industry
1.1.1 Overview
1.1.2 Products of Major Companies
1.2 Market Segment
1.2.1 Industry Chain
1.2.2 Consumer Distribution
1.3 Price & Cost Overview
2 Wire Bonder Equipment Market by Type
2.1 By Type
2.1.1 Ball bonders
2.1.2 Stud-bump bonders
2.1.3 Wedge bonders -
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